THE INFOTEKS

Mercedes-Benz has revealed the second generation GLA which with its promising new technology and greater comfort with step of the pressure on the BMW X1 in the first growing compact luxury SUV market.      Stylistical ly the new GLA build on a foundation of it's predecessor's albeit with ground clearance raised by 9mm 2143 mm the exterior pacing with more ragged deleting than other compact Mercedes model including plastic clouding on the wheel arches and bumpers. The new GLA is 40 mm shorter and 2 mm narrower but is 104 mm higher than the old model giving it a more SUV esque look compared to its predecessor . It's based on a second generation version of Mercedes MFA platform with a transvestites  engine mounting and has its wheel weight extended by 30mm to 2729 mm and its track increased by 46mm front and rear.   Inside the new GLA is a similar to other recent Mercedes models featuring and dashboard with a freestanding digital display panel this c

The introduction of a 16 in macBook Pro is not technically as much of a departure as it might seem. V model release last year actually has a screen that measure 15.5 in diagonally and since this one is exactly 16 it's is only 0.4 in bigger.         Steal it easy to impress even small improvement when this new MacBook Pro is among the most portable and compact high power laptops money can buy it is a mayor 16 mm thick 24 6 mm deep and 358 mm wide and while its 2 kg makes it know hawat considering the power sqeezed inside including and Octa Core octaCore i99980h k professor that not enough to be of putting. Fly Away Layout wise it is similar to V model which is to say it's fairly minimalist around the edges. There are four Thunderbolt 3 port and a single 3.5 mm audio jack which might this point anyone wanting full size USB port for the return of the SD card slots but at least you are getting maximum transfer speed and versatile from those multiple Thun

Inter quotes mobile modern market to focus on 5G Intel not only make processor it also make component such as mobile modem semiconductors for the like of Apple to use in its smartphones.                But in December Intel quotes making mobile modem chips and selling that side of its business to Apple for 1 billion dollar. The reason for doing so was placed formally at the door of qualcomm, which is a major provider of modem chips for mobile gadget alongside its Snapdragon chipset.      Intel suffered the brunt of qualcomms anti competitive behaviour and opportunities in the modern market was prevented from am making sale to customer and was forced to sell a price artificially skewed by qualcomms according to the internal vice president and general counsel .     The victims were qualcomms own  customer the long list of competitors it force out to the modern chip market including Intel and ultimately consumers.     Intel vice president sad fought  for